Schneider Electric 140XBP00300 Quantum backplane 3 slots New Original

Main range of product: Modicon Quantum automation platform

Product or component type: DIO head-end adaptor

• Complementary number of port: 1 Modbus Plus fiber optic single copper, 1 Modbus RS232 twisted pair
• Transmission rate: 1 Mbit/s
• Electrical connection: 1 connector RJ45, 2 connectors TX/RX
• I/O words: 30 I/32 O
• Checks: RAM, RAM address, Processor, Checksum
• Power dissipation: 4 W
• Minimum pulse width distortion/jitter: 5 ns
• Wavelength: 820 nm
• Power loss budget: 11 dB 62.5/125 µm, 16.5 dB 100/140 µm, 6.5 dB 50/125 µm
• Optical transmission: -16…-9 dBm 100/140 µm, -19.8…-12.8 dBm 50/125 µm, -3.5…110.5 dBm 62.5/125 µm
• Rise/fall time: 20 ns
• Dynamic range: 20 dB
• Detected silence: -36 dBm
• Sensitivity scale: > 30 dBm
• Bus current requirement: 750 mA

• Resistance to electrostatic discharge: 4 kV contact conforming to IEC 801-2, 8 kV on air conforming to IEC 801-2
• Resistance to electromagnetic fields: 10 V/m 80…2000 MHz conforming to IEC 801-3
• Ambient air temperature for operation: 0…60 °C
• Ambient air temperature for storage: -40…85 °C
• Relative humidity: 95% without condensation
• Operating altitude: ≤ 5000 m
• Standards: UL 508

• CSA Class 1 Division 2
• RINA
• GL
• RMRS
• C-Tick
• GOST
• DNV

• Sustainable offer status: Green Premium product
• REACh Regulation: REACh Declaration
• EU RoHS Directive: Pro-active compliance (Product out of EU RoHS legal scope) EU RoHS Declaration
• Mercury free: Yes
• RoHS exemption information: Yes
• China RoHS Regulation: China RoHS declaration
• Environmental Disclosure: Product Environmental Profile
• Circularity Profile: End of Life Information
• WEEE: The product must be disposed on European Union markets following specific waste collection and never end up in rubbish bins

ConneXium™ managed switches (continued) Predefined configuration files (continued) Example topology with predefined configuration files C5, C1 and C3 (1) A common use of this preconfiguration is for interfacing a copper link with a fiber optic link on the primary ring or interfacing a fiber optic link with a copper link. This type of architecture makes it possible to have Ethernet DIO or Ethernet RIO drops some distance away from the PLC. The switch preconfiguration also enables Ethernet RIO and/or several Ethernet DIO device clouds to be connected to a secondary ring.

1. Primary ring, copper/fiber optic medium
2. Ethernet head adaptor 140NOA61100 installed in the Quantum™ rack.
3. ConneXium switch TCSESM083F23F1 with predefined configuration file C2 (2)
4. ConneXium switch TCSESM063F2CU1/CS1 with predefined configuration file C6 (2)
5. ConneXium switch TCSESM063F2CU1/CS1 with predefined configuration file C4 (2)
6. Modicon™ STB Ethernet DIO (3) (4)
7. Connection to Ethernet DIO device cloud, copper medium only
8. Ethernet DIO device cloud (3)
9. Ethernet communication module 140CPU31110
10. Ethernet Interlink cable TCSECN3M3M1S4/1S4U (1 m)